Breaking Boundaries: Chiplet Interconnects, SDVs & Electronica 2024 Embedded Insiders podcast

Embedded Computing Design에서 제공하는 콘텐츠입니다. 에피소드, 그래픽, 팟캐스트 설명을 포함한 모든 팟캐스트 콘텐츠는 Embedded Computing Design 또는 해당 팟캐스트 플랫폼 파트너가 직접 업로드하고 제공합니다. 누군가가 귀하의 허락 없이 귀하의 저작물을 사용하고 있다고 생각되는 경우 여기에 설명된 절차를 따르실 수 있습니다 https://ko.player.fm/legal.

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Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024

11d ago 40:19

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On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.

Next, Rich is joined by Sayeed Ahmed, director at Infineon Technologies, to discuss the electrification of software-defined vehicles, according to Ahmed, there are still some tradeoffs and issues to be solved.

But first, Rich gives us a sneak peek into his trip to Munich for electronica 2024. Stay tuned to hear about the sessions and the top innovators of our Best-in-Show awards.

For more information, visit embeddedcomputing.com

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