Exploring the Convergence of SMT and Semiconductor Industries with ASMPT CEO Robin Ng

EMS@C-LEVEL

Ever wondered how a company navigates through industry disruptions and customer influences? We're here to quench your curiosity as we sit down with Robin NG Group CEO of ASMPT for a compelling conversation about their unique positioning in the semiconductor industry and the strides they're making in the EV market and advanced packaging. Known for its close engagement with customers, ASMPT's secret sauce to success involves a process-oriented working model that keeps its 11,000+ employees on the same page. We'll also be unpacking the role of thermal compression in AI and the company's development of thermal compression tools.
It's time to step into the future as we delve into the convergence of AI technology and innovation at ASMPT. Robin shares exciting details about how the advent of AI has shaped the development of their thermal compression tools, offering a fresh perspective on the transformative power of these emerging technologies. We also discuss the challenges and potential of mass reflow and how ASMPT is leveraging this sweet spot in the technology landscape. Whether you're a tech-enthusiast, an industry professional, or just curious about the world of semiconductors and AI, we promise you a rollercoaster ride of insights and revelations in this episode. Stay tuned!

EMS@C-Level is sponsored by global inspection leaders Koh Young (https://www.kohyoung.com) and Creative Electron (https://creativeelectron.com)

You can see video versions of all of the EMS@C-Level pods on our YouTube playlist.

챕터

1. Exploring the Convergence of SMT and Semiconductor Industries with ASMPT CEO Robin Ng (00:00:00)

2. Navigating Industry Disruptions and Customer Influences (00:00:08)

3. Advantages of Thermal Compression in AI (00:08:09)